Three flagship product lines covering new energy, AI computing, and semiconductor applications — breaking foreign technology monopolies
A revolutionary mesh with printing aperture ratio >92%. By 2026, mainstream PV routes including TOPCon and BC are fully transitioning to full-open mesh — breaking Japan's monopoly and providing the key breakthrough for PV base metallization.
Chip power has leaped from 700W to 2300W, pushing traditional solutions to their physical limits. MLCP micro-channel liquid cooling delivers 5× the efficiency of traditional solutions. Market size projected to exceed 15 billion CNY by 2027.
Z-axis vertical conductive, XY-axis insulating micro-pitch elastic interconnect device. Breaks Japan Shin-Etsu monopoly, fills domestic high-end gap — 20% lower cost, 7-day lead time, the only domestic product meeting standards.
By 2026, mainstream battery routes including TOPCon and BC are fully transitioning to full-open mesh, driving explosive market growth. Japan has long monopolized global high-end mesh supply, making domestic substitution urgently needed. Full-open electroforming mesh is the core breakthrough for PV base metallization, providing critical support for industry cost reduction and efficiency improvement. Nahum has established strategic partnerships with LONGi and Tongwei, securing 100M+ CNY orders.
Chip power has leaped from 700W to 2300W, pushing traditional air cooling and conventional liquid cooling to their physical limits. MLCP micro-channel liquid cooling has become the only viable path for next-gen AI chip thermal management. The 2027 market size is projected to exceed 15 billion CNY (incremental market), with leading manufacturers facing urgent demand. Global mass production vendors are extremely scarce, making first-mover advantage significant — individual customer annual procurement could exceed 10 billion CNY.
Advanced semiconductor packaging is seeing surging demand for high-performance interconnect materials. Japan Shin-Etsu has long monopolized the high-end anisotropic conductive materials market. AMTIC breaks this technical blockade, filling the domestic high-end gap with 20% lower cost and only 7-day lead time — the only domestic product meeting standards. Compatible with BGA, LFBGA, LGA, QFP, and other packaging formats.
The following parameters are based on actual test data and customer mass-production validation results, ensuring authenticity and reliability
Our technology solutions have been validated through real-world applications across multiple high-growth sectors
Full-open electroforming mesh is the core consumable for PV cell grid line printing. In TOPCon cells, fine-line printing can reduce silver paste consumption by over 20%. In BC cells, the full-open structure perfectly matches back-contact designs. In HJT cells, low-temperature silver paste demands higher aperture ratios — the mesh's >92% aperture ratio makes it the ideal choice. LONGi and Tongwei have completed validation and entered mass production.
As AI large model training demand explodes, GPU/TPU chip power has rapidly climbed from 700W to over 2300W, pushing traditional air cooling and conventional liquid cooling to their physical limits. MLCP micro-channel liquid cooling plates achieve zero-distance contact with chip heat sources through omnidirectional micro-channel arrays, delivering over 5× the cooling efficiency of traditional solutions. Applicable to NVIDIA H100/H200, AMD MI300, and other ultra-high power chips, as well as overall cooling solutions for large AI training clusters.
Advanced packaging technologies such as BGA, LFBGA, LGA, and QFP place increasingly stringent demands on interconnect materials. AMTIC anisotropic metal tunnel interconnect adhesive, with its Z-axis vertical conductivity and XY-axis insulation, perfectly solves signal interconnection and electrical isolation challenges in micro-pitch packaging. Compared to traditional ACF conductive adhesive, AMTIC offers lower resistivity, higher reliability, and better cost — already applied in consumer electronics, automotive electronics, and communication modules.
The precision metal forming capabilities of electroforming technology demonstrate unique advantages in manufacturing high-frequency devices such as 6G communication antennas and millimeter-wave filters. Micron-scale precision control and batch production capability for complex 3D metal structures provide critical manufacturing process support for next-generation communication technologies.
The company's technical expertise in nano-imprint and micro-nano optics can be applied to manufacturing AR optical waveguides, diffractive optical elements (DOE), microlens arrays (MLA), and other display optical devices. High-precision micro-nano structure batch replication capability provides a technical path for lightweight and cost-effective consumer-grade AR/VR devices.
Based on space-grade liquid cooling structural design experience, MLCP technology can be applied to extreme environment thermal management in aerospace, satellite thermal control systems, and high-power radar cooling. The high reliability and compact structure of micro-channel liquid cooling technology meet the stringent weight, volume, and reliability requirements of aerospace applications.
From raw material incoming inspection to finished product shipping, every step is strictly controlled to ensure every product meets the highest standards
The company has earned National High-Tech Enterprise certification, with R&D capability and innovation recognized by authoritative institutions. Continuous R&D investment ensures technological leadership.
Full implementation of ISO 9001 quality management system, with strict quality control standards and work instructions at every step from design development, raw material procurement, manufacturing, to outgoing inspection.
Equipped with 3D optical microscopes, scanning electron microscopes (SEM), laser particle size analyzers, thermal conductivity testers, and other advanced inspection instruments to ensure accurate and reliable product performance parameters.
All core products have passed rigorous validation testing by leading customers. Electroforming mesh has passed mass production validation with LONGi and Tongwei. AMTIC has passed reliability testing with multiple semiconductor packaging enterprises.
Production strictly complies with national environmental regulations. Electroforming process wastewater and exhaust gas are professionally treated to meet discharge standards. Active promotion of green manufacturing and sustainable development.
From prototype development to mass production ramp-up, full technical support services are provided. Dedicated project managers track order progress, and technical experts answer process questions to ensure smooth product adoption.
Our technical team will provide professional consultation and tailored solutions for your specific needs
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